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Vortex™ ALD
Vortex™ ALD is a rotary batch technology that uses rotation of a disc or cylinder to transport substrates.
Several angstroms per second, which is faster than many oxide sputtering processes.
No coating anywhere in the chamber except on the substrates and carrier surface.
Precursors are consumed only on the substrate track – exhausted precursor material may be captured and re-used.
Leveraging the advantages of simple DC plasma, our processes are available at 100°C or lower, even down to room temperature.
When paired with PlasmaShield technology it can yeild up to 20 cycles.
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Instead of pulsing and purging precursors from a static substrate in a single chamber, the substrate is transported by rotation to the various precursor and purge zones of the reactor. This eliminates the time required for precursor introduction, saturation, and purge with each ALD cycle. Further, Lotus AT’s patented Radical Enabled ALD process, incorporating Precursor “Separation” by Radical Deactivation technology, greatly simplifies zone separation in the reactor, and enables the use of a simple DC plasma for PEALD processing.
This technology can be scaled from small reactors for research or small area manufacturing, to meter-scale substrates.


A rotary batch technology that uses rotation of a disc or cylinder to transport substrates.

High-speed, low-cost Roll-to-Roll ALD that weaves a flexible substrate through separate precursor regions.

Uses a “flash” of temperature to convert the chemisorbed precursor to the final coating product.

Deposit 1-5 ALD cycles with each pass of the substrate, with up to 5 cycles per second for large area sheet processing.

Highly localized plasma source with a deactivation shroud for suspended operation in precursor-filled chambers.

A flexible Roll-to-Roll platform for moderate speed PEALD with straightforward web handling.
Explore blog articles on ALD innovations, market trends, and case studies plus industry news shaping the future of thin-film deposition.